Compact LWIR Thermal Camera Core

  • The FLIR Boson® 320 Longwave Infrared (LWIR) Thermal Camera Core sets a new standard for size, weight, power, and performance (SWaP).
  • A full-featured VGA thermal camera module just 7.5 grams and less than 4.9 cm³.
  • It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low.
  • It has a 12 µm pitch vanadium oxide (VOx) uncooled detector, a resolution of 320 x 256, and it is available with multiple lens configurations, adding flexibility to integration programs.
  • FLIR’s expandable infrared (XIR) video processing with embedded industry-standard interfaces empowers advanced processing and analytics in an industry-leading system-on-a-chip.
  • Boson new design lets FLIR bring you high resolution cameras at low resolution prices.
  • Improved image quality through various new and improved noise filters for shutterless configurations (also benefits shuttered cameras)
  • USB 3.1 Gen 1 (formerly called USB 3.0 and also called USB 3.2 Gen 1 x 1)
  • External Sync fully validated
  • Miscellaneous bug fixes and optimizations

$1,959.00

170 in stock

SKU: FSIBO320F-C-24 Category:

Features

  • Unmatched image sensitivity
  • Advanced image processing
  • Peripheral sensor drivers
  • Integrates into embedded systems
  • Small size, light weight
  • Various available lens options

Applications

  • Process Control
  • Robotics
  • Industrial Vision Systems
  • Aerial Radiometric Imaging
  • UAV Integration
  • Scientific Research
  • Building Automation
  • Security Monitoring
  • Detector Array: Uncooled VOx Microbolometer
  • Pixel Pitch: 12 µm
  • Pixel Resolution: 320 x 256
  • Spectral Band: 7.5 µm – 13.5 µm
  • Thermal Sensitivity (NETD): < 60 mk (Consumer)
  • Frame Rate: 30/60 Hz Fast Video
  • Dynamic Range: 14 bit
  • Operation Range: -40 °C to 80 °C
  • Storage Range: -50 °C to 105 °C
  • Pixel Operability: > 99%
  • 1500 G Shock @ 0.4 msec
  • Dimensions (without lens): 21 mm x 21 mm x 11 mm (H x W x D ± 0.5 mm)
  • Weight (without lens): 7.5 g
  • UART or USB for Power & Data
  • Peripheral Channels: I2C, SPI, SDIO
  • Video Channels: CMOS or USB2
  • Continuous Electronic Zoom: 1x – 8x zoom
  • f-number: 1.1
  • Image Orientation: Adjustable (vertical flip and/or horizontal flip)
  • Non-Uniformity Correction (NUC): Factory calibrated; updated FFCs with FLIR’s Silent Shutterless NUC (SSN™)
  • Snapshots: Full-frame snapshot, SDIO interface to support removable media
  • Integral Solar protection
  • Symbol Overlay: Re-writable each frame; alpha blending for translucent overlay
  • Scene Dynamic Range (Gain Mode in parentheses): to +140 °C (high) to +500 °C (low)
  • Precision Mounting Holes: Four tapped M16 x 0.35 (rear cover). Lens support is recommended when lens mass exceeds core mass.
  • Input Voltage: 3.3 VDC
  • Power Dissipation: Varies by configuration; as low as 500 mW

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
For the most up-to-date specs, go to www.flir.com/boson

  • 9.1 mm Lens (24° HFOV)