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Teledyne FLIR Boson+ 320

High Performance, Uncooled, LWIR OEM Thermal Camera Module

  • Made in the USA, and ITAR-free, the Boson+ sets the standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP).
  • It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness.
  • Lower video latency enhances tracking, seeker performance, and decision support.
  • Radiometry will be available in the second quarter of 2024 on 640 x 512 and 320 x 256 resolution models.
  • Boson+ maintains the widely-deployed Boson mechanical, electrical, and optical interfaces enabling a plug-and-play upgrade.
  • New models also include factory-integrated continuous zooms lenses to streamline development and maximize performance.
  • With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wider range of embedded processors from Qualcomm, Ambarella, and more.
  • The user-friendly Boson SDK, GUI, and comprehensive product integration documentation further simplify OEM integration.
  • Enhanced thermal performance and industry-leading reliability provide low-risk development, making Boson+ ideal for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

Please allow 4 – 6 weeks lead time.

$1,866.00 – $3,918.00

SKU: FSIBO320+F Category:

DRAMATIC REDUCTION IN SIZE, WEIGHT, AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9 cm3.

  • 21 x 21 x 11 mm camera body and weight as low as 7.5g.
  • Low power consumption, starting at 500 mW
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Rugged construction and highest temperature rating -40 °C to 80 °C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

  • Includes embedded algorithms for noise filters, gain control, blending, and more.
  • Software-customizable functionality for video processing and power dissipation requirements.
  • Built-in support for physical and protocol-level interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.

  • Customized applications through FLIR-trusted third party developers.
  • Mechanical/electrical compatibility across all versions.
  • Variety of hardware and image processing integration to fit OEM requirements.
  • Detector Array: Uncooled VOx Microbolometer
  • Pixel Pitch: 12 µm
  • Pixel Resolution: 320 x 256
  • Spectral Band: Longwave infrared; 8 μm – 14 μm
  • Thermal Sensitivity (NETD): Industrial: ≤20 mK; Professional: ≤30 mK
  • Frame Rate: 60 Hz baseline; 30 Hz runtime selectable Fast Video OR ≤9 Hz Slow Video
  • Scene Dynamic Range: to 150 °C  (high gain) to 350 °C (low gain)
  • Temperature Accuracy: ±5 °C accuracy or less, depending upon operating conditions
  • Operation Range: -40 °C to 80 °C (-40 °F to 176 °F)
  • Storage Range: -50 °C to 85 °C (-58 °F to 185 °F)
  • Shock: 1500 g @ 0.4 msec
  • Dimensions (without lens): 21 mm x 21 mm x 11 mm (H x W x D ± 0.5 mm)
    (0.83″ x 0.83″ x 0.43″ (L x W x H ± 0.02”))
  • Weight (without lens): 7.5 g (configuration dependent)
  • Video Channels: CMOS, MIPI or USB3
  • Control Channels: UART, USB or I2C
  • Configurable GPIO: Up to 11; User configurable
  • Continuous Electronic Zoom: 1x – 8x zoom
  • Non-Uniformity Correction (NUC): Factory calibrated; updated FFCs with FLIR Silent Shutterless NUC (SSNTM)
  • Symbol Overlay: Re-writable each frame; alpha blending for translucent overlay
  • Precision Mounting Holes: Four tapped M16x0.35 (rear cover)
  • Input Voltage: 3.3 VDC
  • Power Dissipation: Varies by configuration; as low as 500 mW
  • Operational Altitude: 12 km (max altitude of a commercial airliner or airborne platform)
  • Solar Protection: Yes, lens only

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
For the most up-to-date specs, go to www.flir.com/products/boson-plus

  • Lenseless (HFOV; effective focal length)
  • 2.3 mm (92° HFOV)
  • 4.3 mm Lens (50° HFOV)
  • 6.3 mm Lens (34° HFOV)
  • 9.1 mm Lens (24° HFOV)
  • 13.8 mm Lens (16° HFOV)
  • 18 mm Lens (12° HFOV)
  • 36 mm Lens (6° HFOV)
  • 55 mm Lens (4° HFOV)