High Performance, Uncooled, Longwave Infrared (LWIR) OEM Thermal Camera Module

  • Made in the USA, and ITAR-free, the Boson+ sets the standard for longwave infrared (LWIR) OEM thermal camera performance and size, weight, and power (SWaP).
  • It features an industry-leading thermal sensitivity of less than or equal to (≤)20 mK and an upgraded automatic gain control (AGC) filter delivering dramatically enhanced scene contrast and sharpness.
  • Lower video latency enhances tracking, seeker performance, and decision support.
  • Radiometry will be available in the second quarter of 2024 on 640 x 512 resolution models.
  • Boson+ maintains the widely-deployed Boson mechanical, electrical, and optical interfaces enabling a plug-and-play upgrade.
  • New models also include factory-integrated continuous zooms lenses to streamline development and maximize performance.
  • With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wider range of embedded processors from Qualcomm, Ambarella, and more.
  • The user-friendly Boson SDK, GUI, and comprehensive product integration documentation further simplify OEM integration.
  • Enhanced thermal performance and industry-leading reliability provide low-risk development, making Boson+ ideal for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.

Please allow 4 – 6 weeks lead time.

$5,130.00$8,188.00

SKU: FSIBO640 Category:

ADVANCED PERFORMANCE WITH IMPROVED THERMAL SENSITIVITY CONTRAST, AND LATENCY
Industry leading NEDT of ≤20 mK extends thermal scene details and detection, recognition, and identification (DRI) performance.

  • ≤20 mK thermal sensitivity
  • Improved latency for faster decision support
  • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
  • Upgraded automatic gain control (AGC) provides blacker blacks and whiter whites

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

  • Low power consumption, starting at 900 mW
  • Compact, 640×512 resolution, 12 μm pixel pitch LWIR microbolometer
  • Rugged construction and operating temperature rating of -40 °C to 80 °C

DESIGNED FOR INTEGRATORS
Shared mechanical/electrical compatibility across all Boson provides plug-and-play with existing designs.

  • Comprehensive product integration documentation and easy-to-use Boson GUI.
  • Highly qualified Technical Services team available to support integration
  • Manufactured in the USA, dual use, and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
  • Flexible USB and CMOS or USB and MIPI interface
  • Detector Array: Uncooled VOx Microbolometer
  • Pixel Pitch: 12 µm
  • Pixel Resolution: 640 x 512
  • Spectral Band: Longwave infrared; 8 μm – 14 μm
  • Thermal Sensitivity (NETD): Industrial: ≤20 mK; Professional: ≤30 mK
  • Frame Rate: 60 Hz baseline; 30 Hz runtime selectable Fast Video OR ≤9 Hz Slow Video
  • Scene Dynamic Range: to 140 °C  (high gain)
  • Temperature Accuracy: ±5 °C accuracy or less, depending upon operating conditions
  • Operation Range: -40 °C to 80 °C (-40 °F to 176 °F)
  • Storage Range: -50 °C to 85 °C (-58 °F to 185 °F)
  • Shock: 1500 g @ 0.4 msec
  • Dimensions (without lens): 21 mm x 21 mm x 11 mm (H x W x D ± 0.5 mm)
    (0.83″ x 0.83″ x 0.43″ (L x W x H ± 0.02”))
  • Weight (without lens): 7.5 g (configuration dependent)
  • Video Channels: CMOS, MIPI or USB3
  • Control Channels: UART, USB or I2C
  • Configurable GPIO: Up to 11; User configurable
  • Continuous Electronic Zoom: 1x – 8x zoom
  • Non-Uniformity Correction (NUC): Factory calibrated; updated FFCs with FLIR Silent Shutterless NUC (SSNTM)
  • Symbol Overlay: Re-writable each frame; alpha blending for translucent overlay
  • Precision Mounting Holes: Four tapped M16x0.35 (rear cover)
  • Input Voltage: 3.3 VDC
  • Power Dissipation: Varies by configuration; as low as 500 mW
  • Operational Altitude: 12 km (max altitude of a commercial airliner or airborne platform)
  • Solar Protection: Yes, lens only

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
For the most up-to-date specs, go to www.flir.com/products/boson-plus

  • Lensless (HFOV; effective focal length) Shutter
  • 4.9 mm Lens (95° HFOV) Shutter
  • 4.9 mm Short Lens (95° HFOV) Shutterless
  • 9.2 mm Lens (50° HFOV) Shutter
  • 14 mm Lens (32° HFOV) Shutter
  • 14 mm Short Lens (32° HFOV) Shutter
  • 18 mm Lens (24° HFOV) Shutter
  • 18 mm Short Lens (24° HFOV) Shutter
  • 18 mm Lens (24° HFOV) Shutterless
  • 18 mm Short Lens (24° HFOV) Shutterless
  • 24.4 mm Lens (18° HFOV) Shutter
  • 24.4 mm Lens (18° HFOV) Shutterless
  • 36 mm Lens (12° HFOV)
  • 55 mm Lens (8° HFOV)
  • 73 mm Lens (6° HFOV)